TECHNICAL SUPPORT

Technical capability translated intoclear sourcing decisions.

Use this capability matrix as an early project-screening guide. Final limits are confirmed against the selected manufacturing site, material system, stack-up and order volume.

PCB CAPABILITY MATRIX

Screen the process route before quotation.

The matrix below converts the original image-based technical sheet into accessible, searchable text. It separates prototype capability from repeat-volume capability so engineering and purchasing teams can review the relevant limits quickly.

Values are a sourcing reference, not a universal guarantee. Final capability depends on material, copper weight, stack-up interaction, panel utilization and the selected partner site.

TECHNICAL CAPABILITY

Prototype and volume capability comparison.

Scroll horizontally on a small screen. The item column remains visible while you compare values.

No.	Item	Sample order ≤2 m²	Volume order >20 m²
1	Layer count	1–24 layers	12 layers
2	Usual base material	FR-4; high-frequency board; aluminium base board; Rogers; high-Tg; copper base board	FR-4; high-frequency board; aluminium base board; Rogers; high-Tg
3	Final board thickness	0.15–4.00 mm (6–196 mil)	0.40–4.00 mm (16–157 mil)
4	Minimum core thickness (excluding copper)	0.075 mm (3 mil)	0.10 mm (4 mil)
5	Final copper thickness	Inner layer: ≤4 oz Outer layer: ≤8 oz	Inner layer: ≤4 oz Outer layer: ≤6 oz
6	Minimum trace width / space before compensation	12 μm base Cu: 3.0 / 3.0 mil 18 μm base Cu: 3.0 / 3.0 mil 35 μm base Cu: 3 / 3 mil 53 μm base Cu: 3 / 6 mil 70 μm base Cu: 5 / 8 mil 105 μm base Cu: 5 / 9 mil 140 μm base Cu: 5 / 12 mil	12 μm base Cu: 3 / 3.5 mil 18 μm base Cu: 3 / 3.5 mil 35 μm base Cu: 3 / 4 mil 53 μm base Cu: 4 / 6 mil 70 μm base Cu: 5 / 8 mil 105 μm base Cu: 6 / 10 mil 140 μm base Cu: 6 / 12 mil
7	Minimum hole size	0.15 mm (6 mil) blind via; 0.20 mm PTH hole	0.20 mm
8	Aspect ratio	14:1	10:1
9	Dimensional tolerance	Hole position: 0.05 mm (2 mil) Countersink: 180° min 2.0 mm, no maximum; 90° min 2.0 mm, max 9.0 mm NPTH: ±0.05 mm (2 mil); PTH: ±0.05 mm (2 mil) Profile: ±0.075 mm (3 mil) Board edge to circuit: ±0.20 mm (8 mil) Warpage, balanced construction: 0.50%	Hole position: 0.075 mm (3 mil) Countersink: 180° min 2.0 mm, no maximum; 90° min 2.0 mm, max 9.0 mm NPTH: ±0.05 mm (2 mil); PTH: ±0.05 mm (2 mil) Profile: ±0.10 mm (4 mil) Board edge to circuit: ±0.20 mm (8 mil) Warpage, balanced construction: 0.75%
10	Surface finishing	HAL; lead-free HAL; immersion gold; immersion tin; immersion silver; OSP; hard gold; carbon ink	HAL; lead-free HAL; immersion gold; immersion tin; immersion silver; OSP; hard gold; carbon ink
11	Maximum finished size	Normal board: 700 × 600 mm Overlong board: 1200 × 600 mm	Normal board: 700 × 600 mm Overlong board: 1200 × 600 mm
12	V-cutting	Board thickness: 0.30–3.2 mm Minimum remaining thickness: 0.2 mm Profile tolerance: ±0.075 mm (3 mil) Minimum tool-jump space: 12 mm V-cut edge to circuit: 0.25 mm	Board thickness: 0.40–3.2 mm Minimum remaining thickness: 0.2 mm Profile tolerance: ±0.10 mm (4 mil) Minimum tool-jump space: 12 mm V-cut edge to circuit: 0.25 mm
13	Slot tolerance	PTH slot: ±0.075 mm (3 mil) NPTH slot: ±0.05 mm (2 mil)	PTH slot: ±0.075 mm (3 mil) NPTH slot: ±0.05 mm (2 mil)
14	Gold finger	Chamfer angle: 20°, 30°, 45° Angle tolerance: ±5° Depth tolerance: ±0.1 mm	Chamfer angle: 20°, 30°, 45° Angle tolerance: ±5° Depth tolerance: ±0.2 mm
15	Minimum hole-to-hole edge spacing after compensation	Same net: ≥6 mil Different nets: ≥8 mil	Same net: ≥8 mil Different nets: ≥12 mil
16	Minimum hole-to-circuit gap	PTH: 5 mil (≤6 layers); 6 mil (≤12 layers); 8 mil (≤18 layers); 12 mil (≤24 layers) NPTH: 0.15 mm (6 mil)	PTH: 8 mil (≤6 layers); 10 mil (≤18 layers); 12 mil (≤24 layers) NPTH: 0.15 mm (6 mil)

Capability must be reconfirmed during quotation and engineering review. Where requirements interact, the most restrictive combined condition applies.

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Technical Support

Technical capability translated intoclear sourcing decisions.

Screen the process route before quotation.

Prototype and volume capability comparison.

Have a demanding stack-up or tolerance?