Production Equipment
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Automatic Dry Film Line
Automated cleaning and lamination improve dry-film adhesion and production consistency.
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Multilayer Board Pressing Machine
Controlled heat and pressure cycles support consistent multilayer lamination and dimensional stability.
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Automatic Horizontal Line
Horizontal wet-process automation supports stable chemistry control and repeatable surface treatment.
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RF / HF PCB Plasma System
Plasma treatment supports reliable hole-wall preparation for demanding RF and high-frequency laminates.
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Automatic CNC Routing Machine
Automated routing provides repeatable board outlines, slots and panel separation profiles.
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Hitachi Drilling Machine
High-speed CNC drilling supports controlled hole position, diameter and multilayer registration.
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Legend Inkjet Printer
Digital legend printing improves marking consistency and supports flexible small-batch production.
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UV Laser Cutting Machine
UV laser processing supports precise profiling of thin, flexible and high-density circuit materials.
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Laser Direct Imaging
Direct imaging supports accurate circuit registration and fine-line production without conventional film tooling.
